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mpx5010 rev 11, 01/2007 freescale semiconductor technical data ? freescale semiconductor, in c., 2007. all rights reserved. integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated the mpx5010/mpxv5010g series piezor esistive transducers are state-of- the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly thos e employing a microcontroller or microprocessor with a/d inputs. this transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. features ? 5.0% maximum error over 0 to 85 c ? ideally suited for mi croprocessor or microcontroller-based systems ? durable epoxy unibody and thermoplastic (pps) surface mount package ? temperature compensated over ?40 to +125 c ? patented silicon shear stress strain gauge ? available in differential and gauge configurations ? available in surface mount (smt) or through-hole (dip) configurations application examples ? hospital beds ?hvac ? respiratory systems ? process control ordering information device type options case no. mpx series order no. packing options device marking small outline package (mpxv5010g series) basic elements gauge, element only, smt 482 mpxv5010g6u rails mpxv5010g gauge, element only, dip 482b mpxv5010g7u rails mpxv5010g ported elements gauge, axial port, smt 482a mpxv5010gc6u rails mpxv5010g gauge, axial port, dip 482c mpxv5010gc7u rails mpxv5010g gauge, axial port, smt 482a mpxv5010gc6t1 tape & reel mpxv5010g gauge, side port, smt 1369 mpxv5010gp trays mpxv5010g gauge, dual port, smt 1351 MPXV5010Dp trays mpxv5010g unibody package (mpx2202 series) basic element differential 867 mpx5010d ? MPXV5010D ported elements differential, gauge 867c mpx5010dp ? MPXV5010Dp gauge 867b mpx5010gp ? mpxv5010gp gauge, axial 867e mpx5010gs ? MPXV5010D gauge, axial pc mount 867f mpx5010gsx ? MPXV5010D mpx5010 mpxv5010g series integrated pressure sensor 0 to 10 kpa (0 to 1.45 psi) 0.2 to 4.7 v output unibody package pin numbers (1) 1. pins 4, 5, and 6 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. 1 v out 4 n/c 2 gnd 5 n/c 3 v s 6 n/c small outline package pin numbers (1) 1. pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. 1 n/c 5 n/c 2 v s 6 n/c 3 gnd 7 n/c 4 v out 8 n/c mpxv5010g6u case 482-01 mpxv5010gc6u/c6t1 case 482a-01 mpxv5010g7u case 482b-03 mpxv5010gc7u case 482c-03 MPXV5010Dp case 1351-01 mpxv5010gp case 1369-01 j small outline package unibody packages mpx5010gsx case 867f-03 mpx5010gp case 867b-04 mpx5010dp case 867c-05 mpx5010d case 867-08 mpx5010gs case 867e-03
mpx5010 sensors 2 freescale semiconductor figure 1. fully integrated pressure sensor schematic sensing element thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry v s v out gnd pins 1 and 5 through 8 are no connects for surface mount package pins 4, 5, and 6 are no connects for unibody package table 1. maximum ratings (1) 1. exposure beyond the specified limits may cause permanent damage or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 75 kpa storage temperature t stg ?40 to +125 c operating temperature t a ?40 to +125 c
mpx5010 sensors freescale semiconductor 3 table 2. operating characteristics ( v s = 5.0 vdc, t a = 25c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 3 required to meet specification.) characteristic symbol min typ max unit pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 0?10kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. v s 4.75 5.0 5.25 vdc supply current i o ? 5.0 10 madc minimum pressure offset (3) (0 to 85 c) @ v s = 5.0 volts 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 0 0.2 0.425 vdc full scale output (4) (0 to 85 c) @ v s = 5.0 volts 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 4.475 4.7 4.925 vdc full scale span (5) (0 to 85 c) @ v s = 5.0 volts 5. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. v fss 4.275 4.5 4.725 vdc accuracy (6) (0 to 85 c) 6. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relati onship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressu re is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pr essure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? variation from nominal: t he variation from nominal val ues, for offset or full scal e span, as a percent of v fss , at 25 c. ??? 5.0 %v fss sensitivity v/p ? 450 ?- mv/kpa response time (7) 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?-ms output source current at full scale output i o+ ?0.1?-madc warm-up time (8) 8. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. ??20?-ms offset stability (9) 9. offset stability is the product's output deviation when subjec ted to 1000 hours of pulsed pressure, temperature cycling with bias test. ?? 0.5 ?- %v fss table 3. mechanical characteristics characteristics typ unit weight, basic element (case 867) 4.0 grams weight, basic element (case 482) 1.5 grams
mpx5010 sensors 4 freescale semiconductor on-chip temperature compensation, cal ibration and signal conditioning the performance over tem perature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. figure 2 illustrates the differential or gauge configuration in the basic chip carrier (case 482). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the mpx5010 and m pxv5010g series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. media, other than dry air, may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. figure 3 shows the recommended decoupling circuit for interfacing the integrated se nsor to the a/d input of a microprocessor or microcontroller. proper decoupling of the power supply is recommended. figure 4 shows the sensor output signal relative to pressure input. typical, minimum, and maximum output curves are shown for operation over a temperat ure range of 0 to 85 c using the decoupling circuit shown in figure 3 . the output will saturate outside of the specified pressure range. figure 2. cross-sectional diagram sop (not to scale) figure 3. recommended power supply decoupling and output filtering (for additional output filtering, please refer to application note an1646.) figure 4. output versus pressure differential fluoro silicone gel die coat wire bond die p1 stainless steel cap thermoplastic case die bond differential sensing element p2 +5 v 1.0 f 0.01 f 470 pf gnd v s v out ips output lead frame differential pressure (kpa) output (v) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 1 2 3 4 5 6 7 8 9 11 10 typical min max transfer function: v out = v s *(0.09*p+0.04) error v s = 5.0 vdc temp = 0 to 85c
mpx5010 sensors freescale semiconductor 5 nominal transfer value: v out = v s x (0.09 x p + 0.04) (pressure error x temp. factor x 0.09 x v s ) v s = 5.0 v 0.25 vdc transfer function (m px5010, mpxv5010g) mpx5010, mpxv5010g series temp multiplier ?40 3 0 to 85 1 +125 3 temperature in c 4.0 3.0 2.0 0.0 1.0 ?40 ?20 0 20 40 60 140 120 100 80 temperature error factor note: the temperature multiplier is a linear re sponse from 0 to ?40c and from 85 to 125c. temperature error band pressure error (max) pressure error band 0 to 10 (kpa) 0.5 (kpa) pressure (kpa) 0.5 0.4 0.2 ?0.3 ?0.4 ?0.5 0 123456 7 89 0 0.3 0.1 ?0.2 ?0.1 10 pressure error (kpa)
mpx5010 sensors 6 freescale semiconductor pressure (p1)/vacuum (p2) side identification table freescale designates the two si des of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing fluorosilicone gel which protects the die from harsh media. the mpx pressure sensor is designed to operat e with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: minimum recommended footprint fo r surface mounted applications surface mount board la yout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. with the correct footprint, the packages will se lf align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. figure 5. sop footprint (case 482) part number case type pressure (p1) side identifier mpx5010d 867 stainless steel cap mpx5010dp 867c side with part marking mpx5010gp 867b side with port attached mpx5010gs 867e side with port attached mpx5010gsx 867f side with port attached mpxv5010g6u 482 stainless steel cap mpxv5010g7u 482b stainless steel cap mpxv5010gc6u/t1 482a side with port attached mpxv5010gc7u 482c side with port attached mpxv5010gp 1369 side with port attached MPXV5010Dp 1351 side with part marking 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 8x 2.54 0.300 7.62 inch mm scale 2:1
package dimensions s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a s t -a- -b- n c m j k pin 1 identifier h seating plane -t- dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 5.38 0.230 0.212 5.84 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.405 0.415 10.29 10.54 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. case 482-01 issue o small outline package pin 1 identifier h seating plane -t- w c m j k v dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a t -a- -b- n s case 482a-01 issue a small outline package mpx5010 sensors freescale semiconductor 7
package dimensions millimeters inches 0.100 bsc 2.54 bsc dim a b c d g j k m n s min 0.415 0.415 0.210 0.026 0.009 0.100 0? 0.405 0.540 max 0.425 0.425 0.220 0.034 0.011 0.120 15? 0.415 0.560 min 10.54 10.54 5.33 0.66 0.23 2.54 0? 10.29 13.72 max 10.79 10.79 5.59 0.864 0.28 3.05 15? 10.54 14.22 pin 1 identifier k seating plane -t- detail x s g 4 5 8 1 -a- -b- c m j n d 8 pl s b m 0.25 (0.010) a s t detail x notes: 1. 2. 3. 4. 5. 6. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension a and b do not include mold protrusion. maximum mold protrusion 0.15 (0.006). all vertical surfaces 5? typical draft. dimension s to center of lead when formed parallel. millimeters inches 0.100 bsc 2.54 bsc dim a b c d g j k m n s v w min 0.415 0.415 0.500 0.026 0.009 0.100 0? 0.444 0.540 0.245 0.115 max 0.425 0.425 0.520 0.034 0.011 0.120 15? 0.448 0.560 0.255 0.125 min 10.54 10.54 12.70 0.66 0.23 2.54 0? 11.28 13.72 6.22 2.92 max 10.79 10.79 13.21 0.864 0.28 3.05 15? 11.38 14.22 6.48 3.17 pin 1 identifier k seating plane -t- w detail x s g 4 5 8 1 -a- -b- n c v m j d 8 pl s b m 0.25 (0.010) a s t detail x notes: 1. 2. 3. 4. 5. 6. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension a and b do not include mold protrusion. maximum mold protrusion 0.15 (0.006). all vertical surfaces 5? typical draft. dimension s to center of lead when formed parallel. case 482c-03 issue b small outline package case 482b-03 issue b small outline package mpx5010 sensors 8 freescale semiconductor
package dimensions mpx5010 sensors freescale semiconductor 9 pin 1 f g n l r 123456 6 pl d seating plane -t- m a m 0.136 (0.005) t positive pressure (p1) c b m j s -a- style 1: pin 1. vout 2. ground 3. vcc 4. v1 5. v2 6. vex style 3: pin 1. open 2. ground 3. +vout 4. +vsupply 5. -vout 6. open style 2: pin 1. open 2. ground 3. -vout 4. vsupply 5. +vout 6. open max millimeters inches 16.00 13.56 5.59 0.84 1.63 0.100 bsc 2.54 bsc 0.40 18.42 30? nom 30? nom 12.57 11.43 dim a b c d f g j l m n r s min 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 max 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 min 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 notes: 1. 2. 3. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension -a- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). case 867-08 issue n unibody package
package dimensions mpx5010 sensors 10 freescale semiconductor case 867b-04 issue g unibody package page 1 of 2
package dimensions mpx5010 sensors freescale semiconductor 11 case 867b-04 issue g unibody package page 2 of 2
package dimensions notes: 1. 2. dimensioning and tolerancing per asme y14.5m, 1994. controlling dimension: inch. r x 123456 port #2 vacuum (p2) port #1 positive pressure (p1) port #1 positive pressure (p1) pin 1 port #2 vacuum (p2) seating plane seating plane -t- -t- p g c j n b f d 6 pl w v l u s k -q- -a- m q m 0.25 (0.010) t m a m 0.13 (0.005) style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.405 0.435 10.29 11.05 d 0.027 0.033 0.68 0.84 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.063 0.083 1.60 2.11 s u 0.910 bsc 23.11 bsc v 0.182 0.194 4.62 4.93 w 0.310 0.330 7.87 8.38 x 0.248 0.278 6.30 7.06 0.220 0.240 5.59 6.10 notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. inches 0.100 bsc millimeters 2.54 bsc dim a b c d e f g j k n s v min 0.690 0.245 0.780 0.027 0.178 0.048 0.014 0.345 0.300 0.220 0.182 max 0.255 0.820 0.033 0.186 0.064 0.016 0.375 0.310 0.240 0.720 0.194 min 17.53 6.22 19.81 0.69 4.52 1.22 0.36 8.76 7.62 5.59 4.62 max 18.28 6.48 20.82 0.84 4.72 1.63 0.41 9.53 7.87 6.10 4.93 style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex a 654321 c k n e -b- port #1 positive pressure (p1) j -t- s g f d 6 pl pin 1 m b m 0.13 (0.005) t v case 867c-05 issue f unibody package case 867e-03 issue d unibody package mpx5010 sensors 12 freescale semiconductor
mpx5010 sensors freescale semiconductor 13 package dimensions c e v j port #1 positive pressure (p1) -t- -p- m q m 0.25 (0.010) t d 6 pl f g k pin 1 u a b r s n -q- s p m 0.13 (0.005) q s t 654321 style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex millimeters inches 0.100 bsc 2.54 bsc dim a b c d e f g j k n p q r s u v min 1.080 0.740 0.630 0.027 0.160 0.048 0.014 0.070 0.150 0.150 0.440 0.695 0.840 0.182 0.220 max 1.120 0.760 0.650 0.033 0.180 0.064 0.016 0.080 0.160 0.160 0.460 0.725 0.860 0.194 0.240 min 27.43 18.80 16.00 0.68 4.06 1.22 0.36 1.78 3.81 3.81 11.18 17.65 21.34 4.62 5.59 max 28.45 19.30 16.51 0.84 4.57 1.63 0.41 2.03 4.06 4.06 11.68 18.42 21.84 4.93 6.10 notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. case 867f-03 issue d unibody package
mpx5010 sensors 14 freescale semiconductor package dimensions case 1351-01 issue a small outline package page 1 of 2
mpx5010 sensors freescale semiconductor 15 package dimensions case 1351-01 issue a small outline package page 2 of 2
mpx5010 sensors 16 freescale semiconductor package dimensions case 1369-01 issue b small outline package page 1 of 2
mpx5010 sensors freescale semiconductor 17 package dimensions case 1369-01 issue b small outline package page 2 of 2
mpx5010 rev. 11 01/2007 how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support usa/europe or locations not listed: freescale semiconductor, inc. technical information center, el516 2100 east elliot road tempe, arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) www.freescale.com/support japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2007. all rights reserved.

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